Ming Feng Best How we do soldering Supplier,Universal certificate enable our product penetrate world market freely, client can import from MF factory at great convenience pace.
The machine is used to realize the surface welding of different media, which is a physical change process. Firstly, the head end of the gold wire must be treated to form a sphere (MF uses negative electron high pressure to form a sphere), and the welded metal surface shall be preheated first; Then, under the joint action of time and pressure, the gold wire ball produces plastic deformation on the metal welding surface, so that the two media can reach reliable contact, and through ultrasonic friction vibration, the metal bond is formed between the two metal atoms under the action of atomic affinity, so as to realize the welding of gold wire lead. MF gold wire ball welding is superior to silicon aluminum wire welding in electrical performance and environmental application, However, because the weldment with precious metal must be heated, the application range is relatively narrow.
As we all know that Ming Feng Lighting produce LED light, how MF do LED light? how to solder the LED chip to secure quality? LED chip is the core component of LED lamp, that is, p-n junction. Its main function is to convert electric energy into light energy. The main material of the chip is monocrystalline silicon. The semiconductor chip consists of two parts. One part is a p-type semiconductor, in which holes dominate, and the other end is an n-type semiconductor, mainly electrons.
But when the two semiconductors are connected, a p-n junction is formed between them. When the current acts on the chip through the wire, the electrons will be pushed to the p region, where the electrons compound with holes, and then emit energy in the form of photons. This is the principle of LED luminescence. The wavelength of light, that is, the color of light, is determined by the material forming the p-n junction. At present, a conductive wire is connected between the chip platform and the welding wire platform of LED in the whole industry to realize power on.
The two-wire chip LED is welded in the same pole. The patent reduces the welding defect rate by setting two conductive gold wires. However, the two conductive gold wires are fixed by welding silver glue, Due to the influence of temperature, it produces stress, which leads to the collapse of the second solder joint or weak understanding, resulting in poor performance, and when the chip is subjected to high temperature, it is easy to loose between the support and silver glue and the chip. Therefore, the double electrode ball repair of LED chip and the gold wire at the bottom of the chip are proposed.
Technical realization elements:
The purpose of the utility model is to provide a double electrode repair ball of an LED chip and a gold wire welded at the bottom of the chip, so as to solve the problems raised in the above background technology.
In order to achieve the above purpose, the utility model provides the following technical scheme: the LED chip double electrode repair ball and the gold wire at the bottom of the chip, including a second welding support and an LED chip support, the top of the second welding support is fixedly connected with a first gold ball and a second gold ball, the top of the LED chip support is provided with conductive silver glue, and the top of the conductive silver glue is fixedly connected with an LED chip, The top of the LED chip is provided with a first chip electrode and a second chip electrode, the first gold ball and the first chip electrode are connected through a first conductive gold wire, and the second gold ball and the second chip electrode are connected through a second conductive gold wire;
The bottom of the conductive silver glue is fixedly connected with a fourth gold ball, the top of the second welding support is fixedly connected with a third gold ball, and the fourth gold ball and the third gold ball are connected through a third conductive gold wire.
As a further optimization of the technical scheme, the top of the LED chip support is provided with a support, the top of the support is fixedly connected with a damping seat, the interior of the damping seat is fixedly connected with a damping spring, one side of the damping spring is fixedly connected with a cushion seat, and one side of the cushion seat is provided with a rubber pad.